product description:
VIPFIX High Quality 0.12mm Multi-purpose Phone BGA Reballing Stencil High Precision BGA IC Chipset for iPhone 6 6P 6S 6SP 7 7P 8 8P NAND CPU Repair Product Introduction: ※0.12mm high-quality multi-purpose iPhone BGA Stencil Template, maintenance engineer BGA Reballing Stencils for iPhone 6 6P 6S 6SP 7 7P 8 8P, High precision and Not easily deformed High Quality BGA Stencil Template for iPhone BGA CHIPs.
※High Quality DIYFIX BGA Reballing Stencils for iPhone 6 6P 6S 6SP 7 7P 8 8P, multi-purpose iPhone BGA Reballing Stencils for CPU / font / audio / power IC / USB control IC. BGA ICs.
Notes: ※Each type BGA Reballing Stencil template support a variety of BGA ICs, it is multi-purpose iPhone BGA Reballing Stencils
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